Method for processing a carrier

ABSTRACT

A method for processing a carrier may include: forming a plurality of structure elements at least one of over and in a carrier, wherein at least two adjacent structure elements of the plurality of structure elements have a first distance between each other; depositing a first layer over the plurality of structure elements having a thickness which equals the first distance between the at least two adjacent structure elements; forming at least one additional layer over the first layer, wherein the at least one additional layer covers an exposed surface of the first layer; removing a portion of the at least one additional layer to expose the first layer partially; and partially removing the first layer, wherein at least one sidewall of the at least two adjacent structure elements is partially exposed.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a divisional of U.S. patent application Ser.No. 13/833,166 filed Mar. 15, 2013, the entirety of which is hereinincorporated by reference.

TECHNICAL FIELD

Various embodiments relate generally to a method for processing acarrier.

BACKGROUND

Fabricating an integrated circuit, a chip, or a die or processing acarrier may include at least one etch process to generate the desiredshape of a structure element. Applying an etch process, such as plasmaetching or reactive plasma etching for example, may in face of manyadvantages have the problem that loading mechanisms (loading effects),e.g. micro-loading or aspect ratio dependent etching may occur. Thereby,a hole (or a recess) included in an integrated circuit on a carrierhaving a larger open area may finally have a larger depth than anotherhole (or another recess) having a smaller open area, despite using thevery same etch process for both holes (or both recesses). Therefore, thedistance between adjacent structure elements on a wafer and thedimensions of a structure element may influence the etch rate during anetch process.

SUMMARY

A method for processing a carrier in accordance with one or moreembodiments may include: forming a plurality of structure elements atleast one of over and in a carrier, wherein at least two adjacentstructure elements of the plurality of structure elements have a firstdistance between each other; depositing a first layer over the pluralityof structure elements having a thickness which equals the first distancebetween the at least two adjacent structure elements; forming at leastone additional layer over the first layer, wherein the at least oneadditional layer covers an exposed surface of the first layer; removinga portion of the at least one additional layer to expose the first layerpartially; and partially removing the first layer, wherein at least onesidewall of the at least two adjacent structure elements is partiallyexposed.

Furthermore, a method for processing a carrier in accordance with one ormore embodiments may include: forming a plurality of structure elementsat least one of over and in a carrier, wherein at least two adjacentstructure elements of the plurality of structure elements have a firstdistance between each other; depositing a first layer over the pluralityof structure elements having a thickness which is smaller than half ofthe first distance between the at least two adjacent structure elements;forming at least one additional layer over the first layer, wherein theat least one additional layer covers an exposed surface of the firstlayer; removing a portion of the at least one additional layer to exposethe first layer partially; and partially removing the first layer,wherein at least one sidewall of the at least two adjacent structureelements is partially exposed.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, like reference characters generally refer to the sameparts throughout the different views. The drawings are not necessarilyto scale, emphasis instead generally being placed upon illustrating theprinciples of the invention. In the following description, variousembodiments of the invention are described with reference to thefollowing drawings, in which:

FIG. 1 shows a flow diagram of a method 100 for processing a carrier,according to various embodiments;

FIG. 2 shows a flow diagram of a method 200 for processing a carrier,according to various embodiments;

FIGS. 3A to 3H show respectively a cross section of a carrier at variousprocessing stages referring to method 100, according to variousembodiments;

FIGS. 4A and 4B show respectively a cross section of a carrier atvarious processing stages referring to method 200, according to variousembodiments;

FIGS. 5A and 5B show respectively a cross section of a carrier atvarious processing stages referring to method 100, according to variousembodiments;

FIGS. 6A and 6B show respectively a cross section of a carrier atvarious processing stages referring to method 200, according to variousembodiments;

FIGS. 7A and 7B show respectively a cross section of a carrier atvarious processing stages referring to method 200, according to variousembodiments;

FIG. 8 shows a top view and a cross section of a carrier including aplurality of holes, according to various embodiments; and

FIG. 9 shows a top view and a cross section of a carrier including aplurality of recesses, according to various embodiments.

DESCRIPTION

The following detailed description refers to the accompanying drawingsthat show, by way of illustration, specific details and embodiments inwhich the invention may be practiced.

The word “exemplary” is used herein to mean “serving as an example,instance, or illustration”. Any embodiment or design described herein as“exemplary” is not necessarily to be construed as preferred oradvantageous over other embodiments or designs.

The word “over” used with regards to a deposited material formed “over”a side or surface may be used herein to mean that the deposited materialmay be formed “directly on”, e.g. in direct contact with, the impliedside or surface. The word “over” used with regards to a depositedmaterial formed “over” a side or surface, may be used herein to meanthat the deposited material may be formed “indirectly on” the impliedside or surface with one or more additional layers being arrangedbetween the implied side or surface and the deposited material.

The term “lateral” used with regards to the lateral extension of astructure (or the lateral extension of a structure element), may be usedherein to mean an extension along a direction parallel to the surface ofa carrier. That means that the surface of a carrier (e.g. the surface ofa substrate, or the surface of a wafer) may serve as reference. Further,the term “width” used with regards to a width of a structure (or a widthof a structure element) may be used herein to mean the lateral extensionof a structure (or a lateral extension of a structure element). Further,the term “height” used with regards to a height of a structure (or aheight of a structure element), may be used herein to mean an extensionof a structure (or a structure element) along a direction perpendicularto the surface of a carrier.

The word “cover” used with regards to deposited material covering astructure (or a structure element), may be used herein to mean that adeposited material may cover a structure (or a structure element)completely, e.g. covering all exposed sides and surfaces of a structure(or a structure element). The word “cover” used with regards todeposited material covering a structure (or a structure element), may beused herein to mean that the deposited material may cover a structure(or a structure element) at least partially, e.g. at least partiallycovering the exposed sides and surfaces of a structure (or a structureelement).

According to various embodiments, forming a layer (e.g. depositing alayer, e.g. depositing a material, e.g. using a layering process) asdescribed herein may also include forming a layer, wherein the layer mayinclude various sub layers, whereby different sub layers may includedifferent materials respectively. In other words, various different sublayers may be included in a layer, or various different regions may beincluded in a deposited layer or in a deposited material.

Since there may be many individual processes used in semiconductorprocessing (e.g. in the fabrication of an integrated circuit, a chip, ora die, e.g. in processing a carrier, a substrate, or a wafer), usuallycarried out in sequence, several basic manufacturing techniques may beused at least once in the overall process. The following description ofbasic techniques should be understood as illustrating examples, whichtechniques may be included in processes described in the following. Thebasic techniques exemplarily described herein may be not necessarilyneed to be construed as preferred or advantageous over other techniquesor methods, since they only serve to illustrate how one or moreembodiments of the invention may be practiced. For sake of brevity theillustration of basic techniques exemplarily described herein is only ashort overview and should not be considered as exhaustive specification.

According to various embodiments, a specific depth of an etched recessor a specific height of a structure element in an integrated circuit maybe relevant for the functionality of the structure element. Typically, afeature (for example an opening, e.g. a hole or a recess) having alarger open area may be etched faster during an etch process (e.g.during reactive plasma etching) than a feature having a smaller openarea. In other words, a larger open area may generate a larger recess(or deeper recess) during an etch process than a smaller open area.Therefore, if the respective distances between several adjacentstructure elements are different from each other, e.g. due to thespecific design or layout of the integrated circuit, so that two openareas may also differ from each other, an etch process may causedifferent etch results depending on the surrounding of an individualstructure element.

Use of an etch process during patterning of a structure element (e.g.plasma etching) may thus cause several problems, since the etching ratemay depend on the surrounding of the structure element. As an example,the height of a control gate at a sidewall of a fin, as described invarious embodiments in the following, may differ from the specificdesired value due to loading effects during plasma etching of the gatematerial. Therefore, the electrical properties of a fin field-effecttransistor (FinFET) may not be as desired and the operability of theFinFET may be affected.

According to various embodiments, the method for processing a carriermay provide a homogeneous (e.g. symmetrical) surrounding (with respectto an etch process) for each structure element of a plurality ofstructure elements, even though the distance between adjacent structureelements (e.g. fins) may not be the same for all of the structureelements on a carrier, such that loading effects may be avoided orsubstantially reduced during at least one processing stage.

According to various embodiments, one or more of the following basictechniques may be included in the method for processing a carrier.

Layering is one of the techniques in semiconductor processing. In alayering process, a layer (or a material forming a layer) may bedeposited over a surface (e.g. over a carrier, over a wafer, over asubstrate, over another layer, or the like) using deposition techniqueswhich may include chemical vapor deposition (CVD, or a CVD process) andphysical vapor deposition (PVD, or a PVD process), according to variousembodiments. According to various embodiments, the thickness of adeposited layer may be in the range of a few nanometers up to severalmicrometers depending on its specific function of the layer. Further,according to various embodiments, a layer may include at least one of anelectrically insulating material, an electrically semiconductingmaterial, and an electrically conductive material, depending on therespective specific function of the layer. According to variousembodiments, electrically conductive materials, as for example aluminum,aluminum-silicon alloys, aluminum-copper alloys, nichrome (an alloy ofnickel, chromium, and/or iron), tungsten, titanium, molybdenum, or gold(or the like), may be deposited using CVD or PVD. According to variousembodiments, semiconducting materials, as for example silicon (e.g.epitaxially grown silicon or polycrystalline silicon (also referred toas polysilicon)), germanium, a semiconductor compound material such asgallium arsenide (GaAs), indium phosphide (InP), or indium galliumarsenide (InGaAs) may be deposited using CVD. Insulating materials, asfor example silicon oxide or silicon nitride (or the like) may bedeposited using CVD or PVD. According to various embodiments,modifications of these processes may be used as described in thefollowing.

According to various embodiments, a chemical vapor deposition process(CVD process) may include a variety of modifications, as for exampleatmospheric pressure CVD (APCVD), low pressure CVD (LPCVD), ultrahighvacuum CVD (UHVCVD), plasma enhanced CVD (PECVD), high density plasmaCVD (HDPCVD), remote plasma enhanced CVD (RPECVD), atomic layer CVD(ALCVD), vapor phase epitaxy (VPE), metal organic CVD (MOCVD), hybridphysical CVD (HPCVD), and the like. According to various embodiments,polysilicon, silicon dioxide, silicon nitride, and the like may bedeposited using LPCVD, but also molybdenum, tantalum, titanium, nickel,tungsten, and the like may be deposited using LPCVD.

According to various embodiments, physical vapor deposition may includea variety of modifications, as for example magnetron sputtering,ion-beam sputtering (IBS), reactive sputtering, high-power impulsemagnetron sputtering (HIPIMS), vacuum evaporation, molecular beamepitaxy (MBE), and the like.

According to various embodiments, a layering process may also includethermal oxidation (also referred to as thermal oxidation process).According to various embodiments, thermal oxidation may be used to growhigh quality silicon oxide layers (so-called high temperature oxidelayer (HTO)) on a silicon surface, e.g. at temperatures in the rangefrom about 800° C. to about 1200° C. The thermal oxidation may beperformed at atmospheric pressure or at high pressure and as furtherdevelopment as a rapid thermal oxidation process (RTO). According tovarious embodiments, also thermal nitridation may be applied to generatehigh quality nitride or oxynitride layers (e.g. silicon nitride layersor silicon oxynitride layers), e.g. using rapid thermal nitridation(e.g. at temperatures up to about 1300° C.).

It should be noted, that a variety of combinations of the materials andprocesses may be used within a layering process, according to variousembodiments. Depending on specific aspects, as for example crystallinequality, surface roughness, edge covering behavior, growth speed, andyield, the most suitable process may be applied for the respectivematerial, according to various embodiments.

According to various embodiments, some processes during processing acarrier may require a conformally deposited layer or conformallydepositing a layer (e.g. forming a conformal layer over a plurality ofstructure elements, e.g. forming a conformal layer over a plurality offins), which means that a layer (or a material forming a layer) mayexhibit only small thickness variations along an interface with anotherbody, e.g. a layer may exhibit only small thickness variations alongedges, steps and/or other elements of the morphology of the interface.According to various embodiments, layering processes such as plating,atomic layer deposition (ALD), or several CVD processes (e.g. ALCVD, orLPCVD) may be suitable to generate a conformal layer or a conformallydeposited layer of a material. With other words, a conformal depositionprocess may exhibit a high edge coverage. According to variousembodiments, growing a high temperature oxide layer (e.g. by using anRTA process) on a silicon surface may be regarded as conformaldeposition process, or more precisely as conformal growth of a hightemperature oxide layer.

Further, according to various embodiments, a conformal deposition of alayer or a conformal growth of a high temperature oxide layer maycompletely fill a recess or a trench, if the width of the recess or thetrench is smaller than two times the layer thickness of the conformallayer. According to various embodiments, a recess or a trench may bepartially filled with a material of a conformally deposited layer or aconformally grown high temperature oxide layer, if the layer thicknessof the conformal layer is smaller than half of the width of the recessor the trench. According to various embodiments, if a recess or a trenchis partially filled with a material of a conformally deposited layer ora conformally grown high temperature oxide layer, a remaining space maybe generated within the recess or the trench, or a remaining space maybe generated between the respective sidewalls of the at least twoadjacent structure elements forming the recess or the trench. Accordingto various embodiments, if a region between two adjacent structureelements is partially filled with a material of a conformally depositedlayer or a conformally grown high temperature oxide layer, a remainingspace may be generated in the region between two adjacent structureelements. In more detail, a remaining space may be free of any materialdeposited in a preceding process (e.g. the remaining space may be freeof any material which may be deposited prior to this during forming aplurality of structure elements and depositing a material over theplurality of structure elements).

Patterning is another technique in semiconductor processing. Accordingto various embodiments, a patterning process may include removingselected portions of a surface layer or of a material. After a surfacelayer is partially removed, a pattern (or a patterned layer or patternedsurface layer) may remain over the underlying structure (e.g. a patternmay remain on a wafer). Since a plurality of processes may be involved,according to various embodiments, there are various possibilities toperform a patterning process, wherein aspects may be: selecting at leastone portion of a surface layer (or a material) which shall be removed,e.g. using at least one lithographic process; and removing the at leastone selected portion of the surface layer, e.g. using at least one etchprocess.

According to various embodiments, a variety of lithographic processesmay be applied generating a lithographic mask (a so-called photomask),as for example photolithography, microlithography or nanolithography,electron beam lithography, X-ray lithography, extreme ultravioletlithography (EUV or EUVL), interference lithography, and the like.According to various embodiments, a lithographic process may include atleast one of an initial cleaning process, a preparation process,applying a resist (e.g. a photoresist), exposing the resist (e.g.exposing the photoresist to a pattern of light), developing the resist(e.g. developing the photoresist using a chemical photoresistdeveloper).

According to various embodiments, an initial cleaning process or acleaning process, which may be included in a lithographic process (orwhich may be included in a general process in semiconductor processing),may be applied to remove organic or inorganic contaminations (ormaterial) from a surface (e.g. from a surface layer, from a carrier,from a wafer, and the like) by for example wet chemical treatment.According to various embodiments, the initial cleaning process or acleaning process may include at least one of the following processes:RCA (Radio Corporation of America) cleaning (also known as Organic Clean(SC1) and Ionic Clean (SC2)); SCROD (single-wafer spin cleaning withrepetitive use of ozonized water and diluted HF); IMEC wafer cleaning;post chemical mechanical polishing (post-CMP) cleaning process; cleaningvia de-ionized water (DIW), piranha etch and/or a metal etch; (and thelike). According to various embodiments, a cleaning process may also beapplied for removing a thin oxide layer (e.g. a thin silicon oxidelayer) from a surface (e.g. from a surface layer, from a carrier, orfrom a wafer, and the like).

According to various embodiments, a preparation process, which may beincluded in a lithographic process, may be applied to promote theadhesion of a photoresist to a surface (e.g. to a surface layer, to acarrier, or to a wafer, and the like). According to various embodiments,the preparation process may include applying a liquid or gaseousadhesion promoter (e.g. bis(trimethylsilyl)amine (HMDS)).

According to various embodiments, a resist, which may be included in alithographic process, may be applied to cover a surface (e.g. a surfacelayer, a carrier, or a wafer, and the like) homogeneously. According tovarious embodiments, applying a resist may include spin coating togenerate a thin homogenous layer of the resist. Afterwards, a resist maybe prebaked to drive off excess resist solvent, according to variousembodiments. According to various embodiments, several types of resists(e.g. a photoresist) may be used adapted to the process of exposing theresist to achieve desired results. According to various embodiments,positive photoresists (e.g. DNQ-Novolac, PMMA, PMIPK, PBS, and the like)may be used, whereby the resist that has been exposed to light becomessoluble to a photoresist developer, and/or negative photoresists (e.g.SU-8, poly isoprene, COP, and the like) may be used, whereby the resistthat has been exposed to light becomes insoluble to a photoresistdeveloper.

According to various embodiments, a resist may be exposed (e.g. exposingthe photoresist to a pattern of light), which may be included in alithographic process, to transfer a desired pattern to a resist, e.g.using light or electrons, wherein the desired pattern may be defined bya patterned mask (e.g. a glass carrier with a patterned chromium layer).According to various embodiments, mask-less lithography may be applied,wherein a precise beam (e.g. an electron beam or a laser beam) may beprojected without using a mask directly onto the surface including theresist. According to various embodiments, the exposure to light maycause a reaction in the resist that may allow that some of the resistmay be removed by a special solution (a so-called developer, e.g. aphotoresist developer). Since the resolution of an optical imagingprocess is limited by the used wavelength, the wavelength of the usedlight may range from the wavelength of the visible light to a smallerwavelength in the ultra violet range, according to various embodiments.According to various embodiments, the exposure may be performed usingx-rays or electrons having even a shorter wavelength than ultra violetlight. According to various embodiments, projection exposure systems(e.g. steppers or scanners) may be used projecting the mask many timesonto a surface including a resist to create the complete exposurepattern.

According to various embodiments, a resist may be developed (e.g.developing the photoresist using a photoresist developer), which may beincluded in a lithographic process, to partially remove the resist, thusgenerating a patterned resist layer remaining on the surface (e.g. on asurface layer or on a carrier, a wafer, and the like). According tovarious embodiments, developing a resist may include a post exposurebake (a heat treatment, e.g. rapid thermal processing) before the actualdeveloping process may be performed. According to various embodiments, adeveloping process may use a special chemical solution (a so-calleddeveloper) as for example sodium hydroxide or tetramethylammoniumhydroxide (TMAH, a metal ion free developer). According to variousembodiments, a remaining patterned resist may be solidified in a hardbake process (a heat treatment, e.g. rapid thermal processing),realizing a more durable protecting layer for later processes as forexample ion implantation, wet chemical etching, or plasma etching (andthe like).

Independently from the described lithographic processes, a resist may beremoved completely at a desired processing stage (e.g. after at leastone of an etch process, ion implantation process, and a depositionprocess have been performed) in a so-called resist strip process.According to various embodiments, a resist may be removed chemicallyand/or by using oxygen plasma.

It should be noted, that a lithographic process, according to variousembodiments, including applying a resist, exposing a resist anddeveloping a resist may also be considered as a patterning process,wherein a patterned resist layer (a soft mask, or a resist mask) may begenerated by the lithographic process. Further, according to variousembodiments, subsequently using an etch process a pattern can betransferred from a patterned resist layer to a previously deposited orgrown layer (or a carrier, and the like), wherein the previouslydeposited or grown layer may include a hard mask material as for examplean oxide or a nitride (e.g. silicon oxide, e.g. silicon nitride)creating a so-called hard mask.

According to various embodiments, an etch process, which may be includedin a patterning process, may be applied to remove material from apreviously deposited layer, a grown surface layer, a carrier (orsubstrate, or wafer), and the like. According to various embodiments, anetch process may be performed depending on the specific requirements forthis process. According to various embodiments, an etch process may beselective or non-selective with respect to a specific material.According to various embodiments, an etch process may be isotropic oranisotropic, wherein an anisotropic etch process (e.g. an anisotropicwet etch process) may reveal a different etching rate along a respectivecrystallographic direction of a specific material or wherein ananisotropic etch process (e.g. an anisotropic dry etch process) mayreveal a different etching rate for surfaces with a specific geometricalignment.

According to various embodiments, a dry etch process may be applied, asfor example plasma etching, ion beam milling, or reactive ion etching(RIE).

Plasma etching generates charged ions, neutral atoms and/or radicals.During the plasma etch process the chemical reactions between theelements of the etched material and the reactive species generated bythe plasma may generate volatile etch products (e.g. etch products beingvolatile at room temperature). Therefore, according to variousembodiments, a plasma etch process may be isotropic and may be highlyselective, partially selective, or non-selective depending on the usedgaseous plasma etchants and the involved materials. According to variousembodiments, silicon may be etched using plasma etchants like CF₄, SF₆,NF₃, or Cl₂ and silicon dioxide may be etched using plasma etchants likeCF₄, SF₆, NF₃, and as an exemplary result, the plasma etch process maybe selective to silicon (e.g. using Cl₂ as plasma etchant) and theplasma etch process may be non-selective to silicon and silicon dioxide(e.g. using CF₄, SF₆, NF₃ as plasma etchants). According to variousembodiments, the plasma etch process may be selective to silicondioxide. According to various embodiments, the plasma etch process maybe selective to silicon.

According to various embodiments, a physical etch process may be applied(e.g. ion beam milling or sputter etching), wherein a material isbombarded with energetic ions of noble gases (e.g. argon ions), whereinatoms are removed from the bombarded material by the transferredmomentum. According to various embodiments, the ions may approach amaterial approximately from one direction, and therefore, ion beammilling may be highly anisotropic and as there may be no chemicalreaction involved ion milling tends to be non-selective.

According to various embodiments, a reactive ion etching (RIE) processmay be applied. According to various embodiments, the ions maychemically react with a material, but can also remove atoms from thesurface of a material by the transferred momentum (sputtering).Depending on the etchants and the involved materials, RIE may beconfigured to be selective or non-selective to specific materials.According to various embodiments, due to the mostly vertical delivery ofreactive ions, reactive ion etching may be configured to be ananisotropic etch process. The etch conditions in an RIE system maydepend on process parameters like pressure, gas flow, and radiofrequency (RF) power. Further, the etch conditions during an RIE processmay depend on the aspect ratio of the structure which shall be etcheddue to so-called loading effects (e.g. aspect ratio dependent etching(ARDE), and the distance between structure elements which shall beetched due to so-called micro-loading.

Further, according to various embodiments, to create a deep penetration,steep-sided holes and trenches in a material (e.g. in a wafer, in asubstrate, in a deposited or grown layer, and the like) deepreactive-ion etching (DRIE) may be applied. Deep reactive-ion etching isan anisotropic etch process, typically with high aspect ratios.According to various embodiments, a pulsed etching (time-multiplexedetching) may be applied. Pulsed etching is an anisotropic etch process,which may be used to create structure elements with high aspect ratios.

It should be noted that the anisotropy in a dry etch process may resultfrom the anisotropic momentum of the ions (or atoms, or molecules).Therefore, in contrast to a wet etch process, the crystal structure mayhave a minor influence on the resulting etch structures using a dry etchprocess. Additionally, in contrast to wet etch processes, alsopolycrystalline materials (e.g. polysilicon) featuring randomly orientedcrystallites can be etched anisotropically creating structures with highaspect ratios (ratio of width to height of a structure element), e.g.1:10 or even greater, e.g. 1:50 or even greater.

According to various embodiments, a patterned layer may also serve as amask for other processes like etching, ion implantation or layering (aso-called hard mask). Further, according to various embodiments, apatterned photoresist may also serve as a mask (a so-called soft mask).According to various embodiments, a soft mask may be used for a lift-ofprocess. The mask material may usually be selected with regard tospecific needs as for example chemical stability, e.g. to perform aselective etch process which does not affect the mask material (e.g.etching away the mask material completely), or mechanical stability,e.g. to protect regions from being penetrated by ions, or to define theshape of generated structure elements during a layering process, and thelike.

Since the desired shapes and structure elements may be generated intheir exact dimensions (feature size) during a patterning process,patterning may be the most critical process regarding the reduction ofthe feature size. Errors during a patterning process may cause adistorted pattern or a misplaced pattern and therefore may change theelectrically functioning of a device or of an integrated circuit. Errorsin the depth of an etched recess or a deviance in the shape of agenerated structure element from a desired design or layout, e.g. due toloading effects during an etch process, may affect the functionality ofa structure element. Therefore, the patterning process may be adapted tothe specific design or layout of an integrated circuit.

According to various embodiments, a heat treatment may be included atvarious points, e.g. in combination with a patterning process, as forexample after an ion implantation process, after applying photoresist toexpel solvents, or after depositing electrical contacts to alloy theelectrically conductive material (e.g. a metal) with a carrier (e.g. awafer, and the like), or to provide optimal deposition conditions forCVD processes (and the like). According to various embodiments, theheating of a carrier (a wafer, a substrate, and the like) may beperformed with direct contact, e.g. a hot plate, or by radiation, e.g.using a laser or lamps. According to various embodiments, a rapidthermal processing (RTP) may be applied, which may be performed undervacuum conditions using a laser heater or lamp heater, wherein amaterial (e.g. a wafer, a substrate, a carrier, and the like) may beheated up to several hundred degrees Celsius or up to about 1000° C. oreven greater within a short time period, e.g. within several seconds(e.g. about 1 s to about 10 s). Subsets of rapid thermal processing arerapid thermal annealing (RTA) and rapid thermal oxidation (RTO).

According to various embodiments, a planarization process may be appliedas for example to reduce the surface roughness or the reduced variationsin the depth profile of a carrier or a wafer surface including structureelements having different heights, since some processes may require aflat surface (a planar surface) (e.g. high resolution lithography).According to various embodiments, a planarization process may benecessary as the number of performed layering processes and patterningprocesses increases and as a planar surface may be required.

According to various embodiments, a chemical mechanical polishingprocess (CMP or CMP process) may be performed, wherein this process maybe selective to at least one specific material on the surface of acarrier (e.g. on the main processing surface of a wafer or a substrate,e.g. on a surface layer, and the like). According to variousembodiments, a chemical mechanical polishing process (CMP) may beperformed, wherein this process may be non-selective to a specificmaterial on the surface of a carrier (e.g. on the main processingsurface of a wafer or a substrate, e.g. on a surface layer, and thelike). According to various embodiments, a planarization process may beincluded additionally in several processes, e.g. in layering processes,patterning processes, and the like.

According to various embodiments, chemical mechanical polishing (a CMPprocess) may be used to remove at least one material from a surfacelayer or at least to partially remove at least one material from asurface layer (e.g. from a main processing surface of a wafer or asubstrate). According to various embodiments, chemical mechanicalpolishing may be used to remove various materials from an exposed regionon the surface of a carrier. According to various embodiments, using achemical mechanical polishing process, a flat surface may be generatedby removing at least partially at least one material from the surface ofa carrier. According to various embodiments, the surface of the carriermay be a main processing surface of a wafer or a main processing surfaceof a substrate. According to various embodiments, the main processingsurface may include at least one structure element.

According to various embodiments, the carrier (e.g. a substrate, awafer, and the like) may be made of semiconductor materials of varioustypes, including silicon, germanium, Group III to V or other types,including polymers, for example, although in another embodiment, othersuitable materials can also be used. In an embodiment, the wafersubstrate is made of silicon (doped or undoped), in an alternativeembodiment, the wafer substrate is a silicon on insulator (SOI) wafer.As an alternative, any other suitable semiconductor materials can beused for the wafer substrate, for example semiconductor compoundmaterial such as gallium arsenide (GaAs), indium phosphide (InP), butalso any suitable ternary semiconductor compound material or quaternarysemiconductor compound material such as indium gallium arsenide(InGaAs).

FIG. 1 shows a flow diagram of a method 100 for processing a carrieraccording to various embodiments. Method 100 may include, in 110,forming a plurality of structure elements at least one of over and in acarrier, wherein at least two adjacent structure elements of theplurality of structure elements may have a first distance between eachother; further, in 120, depositing a first layer over the plurality ofstructure elements having a thickness which equals the first distancebetween the at least two adjacent structure elements; in 130, forming atleast one additional layer over the first layer, wherein the at leastone additional layer may cover an exposed surface of the first layer; in140, removing a portion of the at least one additional layer to exposethe first layer partially; and, in 150, partially removing the firstlayer, wherein at least one sidewall of the at least two adjacentstructure elements may be partially exposed.

FIG. 2 shows a flow diagram of a method 200 for processing a carrieraccording to various embodiments. Method 200 may include, in 210,forming a plurality of structure elements at least one of over and in acarrier, wherein at least two adjacent structure elements of theplurality of structure elements have a first distance between eachother; further, in 220, depositing a first layer over the plurality ofstructure elements having a thickness which is smaller than half of thefirst distance between the at least two adjacent structure elements; in230, forming at least one additional layer over the first layer, whereinthe at least one additional layer may cover an exposed surface of thefirst layer; in 240, removing a portion of the at least one additionallayer to expose the first layer partially; and, in 250, partiallyremoving the first layer, wherein at least one sidewall of the at leasttwo adjacent structure elements may be partially exposed.

According to various embodiments, the plurality of structure elements,as described referring to method 100 and method 200 and shown in FIG. 1and FIG. 2, may be provided on a main processing surface of the carrier(e.g. formed at least one of over and in the surface of the carrier).According to various embodiments, forming a plurality of structureelements over the surface of the carrier may be considered to be equalwith forming a plurality of structure elements in the surface of thecarrier with respect to applying method 100 and method 200, as describedin the following.

According to various embodiments, at least two adjacent structureelements of the plurality of structure elements, as described referringto method 100 and shown in FIG. 1, may have a distance between eachother which is larger than two times the first distance. That means,that in 110, a plurality of structure elements may be formed, wherein atleast two adjacent structure elements of the plurality of structureelements may have a first distance between each other and at least twoadjacent structure elements of the plurality of structure elements mayhave a distance between each other being larger than two times the firstdistance.

According to various embodiments, forming the at least one additionallayer as described referring to method 100 and as illustrated in FIG. 1,may include forming at least a second layer over the first layer,wherein the second layer may fill a remaining space between adjacentstructure elements of the plurality of structure elements. According tovarious embodiments, if at least two adjacent structure elements of theplurality of structure elements have a first distance between each otherand at least two adjacent structure elements of the plurality ofstructure elements have a distance between each other being larger thantwo times the first distance, filling a remaining space between adjacentstructure elements of the plurality of structure elements may includefilling at least one remaining space having a first width, or filling aplurality of remaining spaces which may include remaining spaces havingdifferent widths.

According to various embodiments, at least two adjacent structureelements of the plurality of structure elements, as described referringto method 200 and shown in FIG. 2, may have a distance between eachother which is larger than the first distance. That means, that in 210,a plurality of structure elements may be formed, wherein at least twoadjacent structure elements of the plurality of structure elements mayhave a first distance between each other and at least two adjacentstructure elements of the plurality of structure elements may have adistance between each other being larger than the first distance.

According to various embodiments, forming the at least one additionallayer as described referring to method 200 and as illustrated in FIG. 2,may include forming a second layer over the first layer and afterwardsforming a third layer over the second layer, wherein at least one of thesecond layer and the third layer may fill a remaining space between theat least two adjacent structure elements. According to variousembodiments, if at least two adjacent structure elements of theplurality of structure elements have a first distance between each otherand at least two adjacent structure elements of the plurality ofstructure elements have a distance between each other being larger thanthe first distance, filling a remaining space between adjacent structureelements of the plurality of structure elements may include filling atleast one remaining space having a first width and filling at least oneremaining space having a width which is larger than the first width.

According to various embodiments, forming a plurality of structureelements at least one of over and in a carrier, as described in 110referring to method 100 and in 210 referring to method 200, may includeforming a plurality of structure elements, wherein each structureelement of the plurality of structure elements may have at least onesidewall and at least one upper surface. According to variousembodiments, the upper surfaces of the plurality of structure elementsmay run parallel to each other, or may have a small deviance from beingparallel to each other, and may be aligned parallel to the surface ofthe carrier, or may have a small deviance from being parallel to thesurface of the carrier. According to various embodiments, the sidewallsof the plurality of structure elements may run parallel to each other,or may have a small deviance from being parallel to each other, and maybe aligned perpendicular to the surface of the carrier, or may have asmall deviance from being perpendicular to the surface of the carrier.

According to various embodiments, a plurality of structure elements maybe formed in a carrier, e.g. by removing part of the material formingthe carrier (e.g. by patterning the carrier using at least onepatterning process). Further, according to various embodiments, forminga plurality of structure elements in a carrier may include a layeringprocess, e.g. a layering process which may be carried out after thepatterning of the carrier to provide the plurality of structure elementsin the carrier. According to various embodiments, the at least one uppersurface of each of the plurality of structure elements may form a commonsurface with the surface of the carrier.

According to various embodiments, a plurality of structure elements maybe formed over a carrier, e.g. by using at least one layering processand at least one patterning process to provide the plurality ofstructure elements over the carrier. According to various embodiments,the upper surfaces of the plurality of structure elements may form acommon surface.

According to various embodiments, the base area of at least onestructure element of the plurality of structure elements may have arectangular shape, or may have a small deviance from a rectangular shape(the base area may be seen in a top view or in a cross section parallelto the surface of the carrier). According to various embodiments, thecross section of at least one structure element of the plurality ofstructure elements may have a rectangular shape, or may have a smalldeviance from a rectangular shape. A small deviance, as mentionedbefore, may be for example a deviance in the angular range from zero tofive degrees (e.g. 1° to 5°, e.g. 0.1° to 2°, or in a similar range).

According to various embodiments, referring to the shape of the basearea and the shape of the cross section of a structure element, astructure element may be, with the exception of some minor differences,for example a cuboid. According to various embodiments, at least onestructure element may be a fin. According to various embodiments, allstructure elements of the plurality of structure elements may have thesame shape, e.g. the shape of a fin. According to various embodiments,the plurality of structure elements may include structure elements whichmay have various shapes. According to various embodiments, at least onestructure element of the plurality of structure elements may have adifferent shape than another structure element of the plurality ofstructure elements. According to various embodiments, at least onestructure element of the plurality of structure elements may have adifferent external dimension (or size) than another structure element ofthe plurality of structure elements.

FIG. 3A schematically shows a cross section of a carrier 302 at aninitial processing stage, in accordance with various embodiments.According to various embodiments, the carrier 302 may be a siliconwafer, a silicon substrate, or a carrier including another semiconductormaterial, as described before. According to various embodiments, thecarrier 302 may have a main processing surface 304, which may be theupper surface of the carrier 302 according to some embodiments.

As described above in 110 with reference to method 100 illustrated inFIG. 1, a plurality of structure elements may be formed at least one ofover and in the carrier 302, wherein at least two adjacent structureelements may have a first distance between each other and at least twoadjacent structure elements may have a distance between each other beinglarger than two times the first distance, according to variousembodiments.

FIG. 3B schematically shows a cross section of the carrier 302 includinga plurality of structure elements (also referred to as structure 301) ata first processing stage. As shown in FIG. 3B, the structure 301 may beformed in the carrier 302. According to various embodiments, thestructure 301 may include a plurality of structure elements 302 a-302 e(five structure elements 302 a, 302 b, 302 c, 302 d, and 302 e are shownas an example, however the number of structure elements may be smallerthan five or larger than five, and may be any number greater than one ingeneral), wherein at least two adjacent structure elements (e.g.structure elements 302 a and 302 b as well as structure elements 302 dand 302 a in the embodiment shown) may have a first distance 303 betweeneach other and at least two adjacent structure elements (e.g. structureelements 302 b and 302 c as well as structure elements 302 c and 302 ein the embodiment shown) may have a distance 305 between each otherbeing larger than two times the first distance 303.

According to various embodiments, each of the plurality of structureelements 302 a-302 e may have a first sidewall 306 a, a second sidewall306 b, and an upper surface 306 c, as shown exemplarily for structureelements 302 a and 302 b. According to various embodiments, the distancebetween two adjacent structure elements may be the distance betweenrespective first and second sidewalls 306 a, 306 b of the two adjacentstructure elements facing each other, e.g. the first distance 303between the two adjacent structure elements 302 a and 302 b may be thedistance between the second sidewall 306 b of structure element 302 aand the first sidewall 306 a of structure element 302 b. According tovarious embodiments, the distance 305 (e.g. the distance between thesecond sidewall 306 b of structure element 302 b and the first sidewall306 a of structure element 302 c) between the two adjacent structureelements 302 b and 302 c may be larger than two times the first distance303 between adjacent structure elements 302 a and 302 b. Further,according to various embodiments, the surface 304 of the carrier 302 mayform a common surface with the respective upper surface 306 c of eachstructure element of the plurality of structure elements 302 a-302 eformed in the carrier 302.

According to various embodiments, the upper surfaces 306 c of thestructure elements 302 a, 302 b, 302 c, 302 d, 302 e as shown in FIG. 3Bmay run parallel to each other, or may have a small deviance from beingparallel to each other, and may be aligned parallel to the surface 304of the carrier 302, or may have a small deviance from being parallel tothe surface 304 of the carrier 302. According to various embodiments,the first and second sidewalls 306 a, 306 b of a structure element, asshown in FIG. 3B, may run parallel to each other, or may have a smalldeviance from being parallel to each other, and may be alignedperpendicular to the surface 304 of the carrier 302, or may have a smalldeviance from being perpendicular to the surface 304 of the carrier 302.

According to various embodiments, the cross sectional shape of thestructure elements 302 a, 302 b, 302 c, 302 d, 302 e may be arectangular shape, or may have a small deviance from being rectangular.A small deviance, as already mentioned before, may be for example adeviance in the angular range from zero to five degrees (e.g. 1° to 5°,e.g. 0.1° to 2°, or in a similar range). According to variousembodiments, the structure elements 302 a, 302 b, 302 c, 302 d, 302 emay be fins. According to various embodiments, all structure elements ofthe plurality of structure elements 302 a-302 e may have the same shape,e.g. the shape of a fin.

According to various embodiments, the structure elements 302 a-302 e maybe formed using one or more of the above described techniques insemiconductor processing, as for example layering and patterning.According to various embodiments, structure 301 may be formed in thecarrier 302 by removing material from the carrier 302 (e.g. by using atleast one lithographic process and subsequently an etch process), suchthat the plurality of structure elements 302 a-302 e are formed in thecarrier 302, as shown in FIG. 3B. According to various embodiments,forming the plurality of structure elements 302 a-302 e (or structure301) may include at least one patterning process. According to variousembodiments, forming the plurality of structure elements 302 a-302 e (orstructure 301) may include at least one patterning process and at leastone layering process (e.g. patterning a silicon wafer and subsequentlygrowing a high temperature oxide layer over the patterned siliconwafer).

According to various embodiments, the structure elements 302 a-302 e mayinclude at least one of the following materials: silicon, silicon oxide,silicon nitride, silicon oxynitride, other semiconductor materials (e.g.germanium, gallium arsenide, and/or indium phosphide), or othersubstrate materials, e.g. metal oxides and/or metal nitrides. Accordingto various embodiments, the processes as described herein may not belimited to structure elements formed of a specific carrier material, asdescribed in the following.

According to various embodiments, a plurality of structure elements maybe formed over a carrier, wherein at least one layering process and atleast one patterning process may be used to form the plurality ofstructure elements. According to various embodiments, the structureelements may be formed of any suitable or desired material using the atleast one layering process (e.g. depositing a silicon layer) and the atleast one patterning process (e.g. patterning the previously depositedsilicon layer) to form the plurality of structure elements. According tovarious embodiments, forming a plurality of structure elements over acarrier may result in a similar structure as structure 301 shown in FIG.3B, and therefore the processes as described herein referring tostructure 301 may also be applied to a similar structure, wherein theplurality of structure elements are formed over the carrier.

As described above in 120 with reference to method 100 illustrated inFIG. 1, a first layer may be deposited over the plurality of structureelements, wherein the first layer may have a thickness which equals thefirst distance between the at least two adjacent structure elements.

FIG. 3C schematically shows a cross section of the carrier 302, at asecond processing stage, wherein a first layer 308 may be deposited overthe plurality of structure elements 302 a-302 e, wherein the first layer308 may have a thickness 309 which equals the first distance 303 betweenthe two adjacent structure elements 302 a and 302 b and between the twoadjacent structure elements 302 d and 302 a, as shown. According tovarious embodiments, the first distance 303 and therefore also thethickness of the first layer 309 may be the smallest distance betweenany two adjacent structure elements included in the plurality ofstructure elements (e.g. included in structure 301). According tovarious embodiments, any two adjacent structure elements in theplurality of structure elements may either have the first distance 303or any distance larger than two times the first distance 303, e.g.distance 305.

As shown in FIG. 3C, the first layer 308 may cover the structure 301,which means that also the bottom surfaces of regions between thoseadjacent structure elements having a distance larger than two times thefirst distance 303 (e.g. the bottom surface of region 311 betweenadjacent structure elements 302 c and 302 e) may be covered withmaterial of the first layer 308.

According to various embodiments, the first layer 308 may not cover thebottom surfaces of regions between those adjacent structure elementshaving a distance larger than two times the first distance 303, e.g. thebottom surface of region 311 between the structure elements 302 c and302 e, or the first layer 308 may be partially removed from the bottomsurfaces in those regions, e.g. in region 311 between the structureelements 302 c, 302 e, after the first layer 308 is deposited over thestructure 301 (e.g. by using a patterning process). According to variousembodiments, the first layer 308 may cover the second sidewall 306 b ofstructure element 302 b and the first sidewall 306 a of structureelement 302 e, wherein these regions are not connected electrically viamaterial of the first layer 308.

According to various embodiments, the first layer 308 may be depositedusing a conformal deposition process, e.g. CVD, LPCVD, atomic layerdeposition (e.g. ALCVD), as described above, such that the thickness 309of the first layer 308 at the sidewalls 306 a, 306 b of the structureelements 302 a-302 e may be the same as on the upper surface 306 c ofthe structure elements 302 a-302 e. According to various embodiments,the first layer 308 may include an electrically conductive material, asfor example at least one of a metal, an alloy, and electricallyconductive semiconductor material (e.g. aluminium, aluminium-siliconalloys, aluminium-copper alloys, nichrome (an alloy of nickel, chromium,and/or iron), tungsten, titanium, molybdenum, or gold (or the like)).According to various embodiments, the first layer 308 may includesilicon (e.g. polycrystalline silicon), for example electricallyconductive silicon (e.g. doped silicon, e.g. doped polycrystallinesilicon). According to various embodiments, the material of the firstlayer 308 may be selected from a group of materials that may be etchedselectively with respect to a material of the structure elements 302a-302 e included in structure 301. According to various embodiments, thematerial of the first layer 308 may be selected from a group ofmaterials that may be etched selectively with respect to a surfacematerial of the plurality of structure elements 302 a-302 e included instructure 301.

According to various embodiments, conformally depositing the first layer308 having a thickness which equals the first distance 303 between thetwo adjacent structure elements 302 a and 302 b (and also between thetwo adjacent structure elements 302 d and 302 a according to theembodiment shown), as shown in FIG. 3C, may result in the formation of aremaining space 310 between adjacent structure elements having adistance between each other which is larger than two times the firstdistance 303 (e.g. between structure elements 302 b and 302 c having thedistance 305, and also between structure elements 302 c and 302 eaccording to the embodiment shown). According to various embodiments,the lateral extension of the remaining space 310 may be large enough tobe filled using an additional layering process subsequently. Accordingto various embodiments, the layer thickness of the first layer 308 maybe in the range from about 10 nm to about 200 nm, e.g. from about 30 nmto about 150 nm, e.g. from about 60 nm to about 120 nm, e.g. a layerthickness of about 90 nm according to one embodiment (or larger than 200nm, according to another embodiment). According to various embodiments,the lateral extension of the remaining space 310 (e.g. distance 305minus two times first distance 303) may be larger than 20 nm, e.g. inthe range of about 20 nm to about 1000 nm.

As described above in 130 with reference to method 100 illustrated inFIG. 1, at least one additional layer may be formed over the firstlayer, wherein the at least one additional layer may cover an exposedsurface of the first layer, as will be described in the following infurther detail with reference to FIG. 3D.

FIG. 3D schematically shows a cross section of the carrier 302, at athird processing stage, wherein an additional layer 312 is formed overthe first layer 308. Thus, a structure 301 a may be obtained. Accordingto various embodiments, the additional layer 312 may cover the firstlayer 308, as shown in FIG. 3D. According to various embodiments, theadditional layer 312 may include an insulating material. According tovarious embodiments, the additional layer 312 may include an oxide, e.g.silicon oxide. According to various embodiments, the additional layer312 may include a nitride, e.g. silicon nitride or titanium nitride.According to various embodiments, the additional layer 312 may includecarbon. According to various embodiments, the material of the additionallayer 312 may be selected from a group of suitable materials, such thatthe material of the first layer 308 may be etched selectively withrespect to the additional layer 312. According to various embodiments,the additional layer 312 may include the same material as the pluralityof structure elements 302 a-302 e included in structure 301. Accordingto various embodiments, the additional layer 312 may include the samematerial as a surface layer of the structure elements 302 a-302 e.

According to various embodiments, the additional layer 312 may be formedby a layering process, as described above. According to variousembodiments, the additional layer 312 may be deposited using CVD or PVD,as described above. According to various embodiments, the additionallayer 312 may be grown using thermal oxidation (e.g. RTO) or thermalnitridation (e.g. rapid thermal nitridation) of the first layer 308,wherein a high temperature oxide (high temperature silicon oxide) or ahigh temperature nitride (high temperature silicon nitride) may beformed over the first layer 308.

According to various embodiments, the additional layer 312 may fill theremaining space 310 between the two adjacent structure elements 302 band 302 c, and also between the two adjacent structure elements 302 cand 302 e according to this embodiment. According to variousembodiments, the additional layer 312 may fill a remaining space betweentwo adjacent structure elements (e.g. structure elements 302 b and 302c) having a distance between each other which is larger than two timesthe first distance 303 (e.g. distance 305 between the two adjacentstructure elements 302 b and 302 c, wherein the distance 305 is largerthan two times the first distance 303 between the two adjacent structureelements 302 a and 302 b).

According to various embodiments, more than one additional layer may beformed over the first layer 308 by using more than one layering process.According to various embodiments, at least one layer of the additionallayers may be formed by thermal oxidation or thermal nitridation of thefirst layer 308, as described above. According to various embodiments,at least one layer of the additional layers may be formed using adeposition process, as for example a CVD process or PVD process (e.g.depositing silicon oxide using a CVD process).

According to various embodiments, at least one layer of the additionallayers may be formed by a conformal deposition process (e.g. LPCVD,atomic layer deposition, ALCVD) or a conformal growth process (e.g. aconformal growth of a high temperature oxide layer or e.g. a conformalgrowth of a high temperature nitride layer). If, for example, theremaining space between two adjacent structure elements has a smallwidth (e.g. a width in a range from about 10 nm to about 100 nm, e.g.between about 20 nm and about 75 nm, e.g. in the range from about 20 nmto about 1000 nm), at least one conformal additional layer may fill theremaining space having the small width.

As described above in 140 with reference to method 100 illustrated inFIG. 1, a portion of the at least one additional layer may be removed toexpose the first layer partially, as will be described in the followingin further detail with reference to FIG. 3E.

FIG. 3E schematically shows a cross section of the carrier 302 at afourth processing stage, wherein the additional layer 312 may bepartially removed. According to various embodiments, a part of theadditional layer 312 may remain after removing the additional layer 312partially (referred to as remaining part 312 a of the additional layer312). As shown in FIG. 3E, according to various embodiments, theadditional layer 312 may be partially removed by etching the surface ofthe structure 301 a shown in FIG. 3D. According to various embodiments,the additional layer 312 may be partially removed by using at least oneetch process (e.g. reactive ion etching, e.g. chemical mechanicalpolishing). According to various embodiments, the at least one etchprocess may be selective to the additional layer 312, such that thefirst layer 308 may not be etched in the same etch process, as shown inFIG. 3E. According to various embodiments, removing a portion of theadditional layer 312 may partially expose the first layer 308. Accordingto various embodiments, one or more regions 314 of the first layer 308may be exposed, as shown in FIG. 3E.

As described above in 150 with reference to method 100 illustrated inFIG. 1, the first layer may be partially removed, wherein at least onesidewall of the at least two adjacent structure elements is partiallyexposed, as will be described in the following in further detail withreference to FIG. 3F.

FIG. 3F schematically shows a cross section of the carrier 302, at afifth processing stage, wherein the first layer 308 is partiallyremoved, wherein the sidewalls 306 a, 306 b of the plurality ofstructure elements 302 a-302 e are partially exposed. According tovarious embodiments, the first layer 308 may be partially removed usingan etch process, as for example a plasma etch process. According tovarious embodiments, the first layer 308 may be partially removed usingreactive ion etching. According to various embodiments, the etch processremoving the first layer 308 partially may be selective to the materialof the first layer 308 and the material of the additional layer 312,which means that the structure elements 302 a-302 e and the remainingpart 312 a of the additional layer 312 may not be etched in thisprocess. Therefore, according to various embodiments, the height 316 ofremaining material of the first layer 308 at the sidewalls 306 a, 306 bof the structure elements 302 a-302 e may be the same (or substantiallythe same) for each structure element of the plurality of structureelements 302 a-302 e, although the distance 305 between the two adjacentstructure elements 302 b and 302 c and between the two adjacentstructure elements 302 c and 302 e may be larger than two times thefirst distance 303 between structure elements 302 a and 302 b. Regardingto this, it has to be noted, that the dependence of the etch rate on theaspect ratio may be reduced or prevented by the remaining material ofthe additional layer 312 (e.g. remaining part 312 a of the additionallayer 312) between the structure elements having a distance larger thantwo times the first distance 303, since the actual open area for etchingthe first layer 308 may be defined by the layer thickness 309 of thefirst layer 308, which equals the first distance 303, as shown in FIG.3F.

According to various embodiments, when etching the first layer 308covering the sidewalls 306 a, 306 b of the structure elements 302 a-302e partially the height 316 of the remaining part of the first layer 308,in other words the etch result, may not depend on the distance betweenadjacent structure elements. That means, the exposed area of thesidewalls 306 a, 306 b of a structure element (e.g. exposed area 314 aand 314 b, as shown in FIG. 3F) may be the same for each structureelement of the plurality of structure elements 302 a-302 e.

In the following, various modifications, extensions, and detailsreferring to the described method 100, as shown in FIG. 1 andexemplified in FIG. 3A to FIG. 3F and the accompanying description, aredescribed.

Referring to method 100, in various embodiments, a portion of the atleast one additional layer may be removed to expose the first layerpartially, in 140. Afterwards, the first layer may be partially removed,in 150, wherein at least one sidewall of the at least two adjacentstructure elements is partially exposed. According to variousembodiments, the method 100 may also be performed (in 140) in thefollowing modification as exemplarily shown in FIG. 3G.

FIG. 3G shows that a portion of the additional layer 312 may be removed,such that the upper surface of the plurality of structure elements 302a-302 e is exposed. Regarding to this, a portion of the first layer 308may also be removed in 140. Due to removing a portion of the additionallayer 312 and a portion of the first layer 308 (e.g. by using a CMPprocess, or another suitable surface etching process) a flat surface maybe formed exposing the upper surface 306 c of at least one structureelement (the upper surface 306 c of structure element 302 a).

As a result, according to various embodiments, a remaining portion ofthe first layer 308 between two adjacent structure elements having thefirst distance 303 between each other (e.g. the remaining portion 308 aof the first layer 308 between the two adjacent structure elements 302 aand 302 b, as shown in FIG. 3G) and a remaining portion of the firstlayer 308 between a structure element and the remaining part 312 a ofthe additional layer 312 (e.g. the remaining portion 308 b (or 308 c) ofthe first layer 308 between structure element 302 b (or 302 c) and theremaining part 312 a of the additional layer 312 a between the twoadjacent structure elements 302 b and 302 c) may have the same width(e.g. the width equal to the first distance 303) independently from thedistance between the adjacent structure elements (e.g. distance 303 ordistance 305 as shown in FIG. 3B). According to various embodiments, thematerial of the first layer 308 (e.g. the remaining portions 308 a, 308b, and 308 c of first layer 308) covering the sidewalls 306 a, 306 b ofthe structure elements 302 a-302 e (as shown in FIG. 3G), may have anopen area of the same size, such that each structure element of theplurality of structure elements 302 a-302 e may have a similarsurrounding despite the different distances 303, 305 between adjacentstructure elements.

Referring to method 100, after removing a portion of the at least oneadditional layer in 140 as shown in FIG. 3G and described in theaccompanying description, the first layer may be partially removed, in150, wherein at least one sidewall of the at least two adjacentstructure elements is partially exposed.

As illustrated in FIG. 3H, a selective etch process may be performed(e.g. reactive ion etching), removing a part of the material of thefirst layer 308) which has remained between adjacent structure elementsof the plurality of structure elements 302 a-302 e after partial removalof the additional layer 312, as described above in connection with FIG.3G. According to various embodiments, due to the remaining part 312 a ofthe additional layer 312 between the adjacent structure elements 302 band 302 c, the open area for etching the first layer 308 may be the samefor all structure elements of the plurality of structure elements 302a-302 e (e.g. the open area may be defined by the first distance 303),as shown in FIG. 3H.

FIG. 2 shows a flow diagram of a method 200 for processing a carrieraccording to various embodiments, wherein the method 200 for processinga carrier may be to some degree similar to the method 100. Inparticular, 210 in method 200 may be carried out in the same way and mayinclude the same materials and processes as 110 in method 100; 230 inmethod 200 may be performed in the same way and may include the samematerials and processes as 130 in method 100; 240 in method 200 may beperformed in the same way and may include the same materials andprocesses as 140 in method 100; and 250 in method 200 may be performedin the same way and may include the same materials and processes as 150in method 100, while 220 in method 200 may differ from 120 in method 100and may include depositing a first layer over the plurality of structureelements having a thickness which is smaller than half of the firstdistance between the at least two adjacent structure elements, as shown.Further, according to various embodiments, a plurality of structureelements (e.g. structure elements 402 a, 402 b, 402 c, 402 d, and 402 eshown in FIG. 4A) may be formed at least one of over and in a carrier302, in 210, wherein at least two adjacent structure elements (e.g. thetwo adjacent structure elements 402 a and 402 b) of the plurality ofstructure elements may have a first distance between each other (e.g.first distance 403 shown in FIG. 4A) and at least two adjacent structureelements (e.g. the two adjacent structure elements 402 b and 402 c shownin FIG. 4A) of the plurality of structure elements may have a distancebetween each other being larger than the first distance (e.g. distance405 shown in FIG. 4A).

FIG. 4A schematically shows a cross section of the carrier 302, at asecond processing stage, wherein a first layer 408 may be deposited overa plurality of structure elements 402 a-402 e (five structure elements402 a, 402 b, 402 c, 402 d, and 402 e are shown as an example, howeverthe number of structure elements may be smaller than five or larger thanfive, and may be any number greater than one in general), wherein thefirst layer 408 may have a thickness 409 which is smaller than half ofthe first distance 403 between the two structure elements 402 a and 402b. According to various embodiments, the first distance 403 may be thesmallest distance between any two adjacent structure elements includedin the plurality of structure elements 402 a-402 e. In other words, anytwo adjacent structure elements in the plurality of structure elementsmay have a distance that is greater than or equal to the first distance403.

As shown in FIG. 4A, the first layer 408 may cover the plurality ofstructure elements 402 a-402 e, which means that also regions betweenthe structure elements 402 a-402 e may be covered (e.g. region 411) withmaterial of the first layer 408. According to various embodiments, inanalogy to 120 in method 100, the first layer 408 may be formed in aconformal deposition process, as described before. According to variousembodiments, in analogy to first layer 308 as described referring tomethod 100, the first layer 408 as shown in FIG. 4A may include anelectrically conductive material, as for example at least one of ametal, an alloy, and electrically conductive semiconductor material(e.g. aluminium, aluminium-silicon alloys, aluminium-copper alloys,nichrome (an alloy of nickel, chromium, and/or iron), tungsten,titanium, molybdenum, or gold (or the like)). According to variousembodiments, the first layer 408 may include silicon (e.g.polycrystalline silicon), for example electrically conductive silicon(e.g. doped silicon, e.g. polycrystalline silicon). According to variousembodiments, the material of the first layer 408 may be selected from agroup of materials that may be etched selectively with respect to thematerial used for forming the structure elements 402 a-402 e. Accordingto various embodiments, the material of the first layer 408 may beselected from a group of materials that may be etched selectively withrespect to a surface material of the plurality of structure elements 402a-402 e.

According to various embodiments, conformally depositing the first layer408 with a thickness which is smaller than half of the first distance403, as shown in FIG. 4A, may result in the formation of a remainingspace 410 a between two adjacent structure elements 402 a and 402 bhaving the first distance 403 between each other and the formation of aremaining space 410 b between two adjacent structure elements 402 b and402 c having a distance 405 between each other, wherein the distance 405may be larger than the first distance 403.

According to various embodiments, the first distance 403 may be in therange from about 10 nm to about 300 nm, e.g. about 20 nm to about 200nm, e.g. about 70 nm to about 110 nm, e.g. about 80 nm to about 100 nm,e.g. about 90 nm, or e.g. smaller than 90 nm or e.g. larger than 90 nm.

According to various embodiments, the layer thickness of the first layer408 may be in the range from about 20 nm to 500 nm, e.g. 50 nm to 200nm, e.g. 20 nm to 40 nm, or in the range of about 30 nm, or e.g. largerthan 30 nm, or e.g. smaller than 30 nm.

According to various embodiments, the lateral extension of the remainingspace (e.g. remaining space 410 a and remaining space 410 b) between therespective two adjacent structure elements may be large enough to befilled using at least one additional layering process in a layeringprocess performed later. According to various embodiments, the lateralextension of a remaining space (e.g. remaining space 410 a (firstdistance 403 minus two times the thickness 409 of the first layer 408)and remaining space 410 b (distance 405 minus two times the thickness409 of the first layer 408)) may be larger than 20 nm, e.g. in the rangeof about 20 nm to about 1000 nm.

According to various embodiments, after 220 of method 200 has beencarried out as described referring to FIGS. 4A, 230, 240, and 250 may becarried out in analogy to method 100 resulting in the structure as shownin FIG. 4B.

As it is illustrated in FIG. 4B, the open areas for etching the firstlayer 408 may be defined by the thickness 409 of the first layer 408.According to various embodiments, at least one additional layer 412 maybe formed over the first layer 408 filling the remaining space betweenthe structure elements 402 a-402 e (e.g. the remaining space 410 abetween the two adjacent structure elements 402 a and 402 b, and theremaining space 410 b between the two adjacent structure elements 402 band 402 c, as shown in FIG. 4A). According to various embodiments, theremaining part 412 a of the additional layer 412 (obtained afterremoving, in 240, a portion of the additional layer 412) may fill theremaining spaces 410 a and 410 b.

Finally, according to various embodiments, independently from thedistance between two adjacent structure elements, material of the firstlayer 408 may remain between the structure elements 402 a-402 e and theremaining part 412 a of the at least one additional layer 412. As aresult, the open areas of the first layer 408 may be independent fromthe distance between adjacent structure elements, and therefore,according to various embodiments, an etch process (e.g. reactive plasmaetching) for removing part of the first layer 408 to partially exposethe sidewalls 406 a, 406 b of the plurality of structure elements 402a-402 e may be independent from an aspect ratio (e.g. etching rates maybe independent from the distance between two adjacent structureelements). According to various embodiments, the open area of the firstlayer 408 may be proportional to the open width (e.g. the open area 418of the first layer 408 may be proportional to the open width (equallayer thickness 409 of the first layer 408) between structure element402 c and remaining part 412 a of additional layer 412). According tovarious embodiments, the remaining material of the first layer 408,after having performed method 200 as described above, may have the same(or substantially the same) height 416 everywhere independently from thedistance between adjacent structure elements, as shown in FIG. 4B.

According to various embodiments, method 100, as shown in FIG. 1 anddescribed referring to FIGS. 3A to 3H, may include forming a pluralityof structure elements, wherein a structure element may include a surfacelayer, wherein the surface layer may include or consist of a differentmaterial than the body of the structure element. According to variousembodiments, a structure element may have the shape of a fin, whereinthe fin may include silicon and the surface layer of the fin may includeelectrically insulating material (e.g. an oxide, e.g. a nitride, e.g.silicon oxide, e.g. silicon nitride, e.g. silicon oxynitride, and thelike) or the surface layer may include a layer stack of more than oneelectrically insulating layer (e.g. an oxide-nitride-oxide layer stackincluding silicon oxide and silicon nitride). According to variousembodiments, at least one structure element of the plurality ofstructure elements (e.g. all structure elements of the plurality ofstructure elements) may be formed by patterning a silicon wafergenerating a silicon structure, wherein the electrically insulatingsurface layer may be formed by high temperature oxidation of the siliconstructure. According to various embodiments, the electrically insulatingsurface layer or the electrically insulating surface layer stack may beformed using a deposition process, e.g. a conformal deposition process,e.g. a conformal CVD process as described above). The following figuresmay illustrate various modifications, extensions, and details referringto the described method 100 and method 200, wherein the plurality ofstructure elements, or at least one structure element of the pluralityof structure elements, may include an insulating surface layer.

As shown in FIG. 5A, according to various embodiments, the plurality ofstructure elements 302 a-302 e may include an electrically insulatingsurface layer 502, wherein the surface layer 502 may be formed at theupper surface 306 c of the structure elements 302 a-302 e (e.g. theupper surface 306 c of structure element 302 c), at the sidewalls 306 a,306 b of the structure elements 302 a-302 e (e.g. the sidewalls 306 a,306 b of structure element 302 c), and bottom regions between thestructure elements 302 a-302 e (e.g. at bottom region 506 b between thestructure elements 302 b and 302 c). According to various embodiments,FIG. 5A may illustrate the cross section of a plurality of structureelements 302 a-302 e (e.g. a plurality of fins) including an insulatingsurface layer 502, wherein two adjacent structure elements (e.g. twoadjacent fins) may have a first distance between each other (e.g. firstdistance 303 between the structure elements 302 a and 302 b) and twoadjacent structure elements (e.g. two other adjacent fins) may have adistance between each other (e.g. distance 305 between structureelements 302 b and 302 c), which is larger than two times the firstdistance (e.g. first distance 303). According to various embodiments,subsequently 130, 140, and 150 of method 100 may be carried out, asalready described above, which may result in a structure 501 as shown inFIG. 5B in analogy to FIGS. 3D to 3H and the accompanying description.

According to various embodiments, method 200, as shown in FIG. 2 anddescribed referring to FIGS. 4A and 4B and referring to method 100, asdescribed above, may include forming a plurality of structure elements,wherein the structure elements may include a surface layer, wherein thesurface layer may include a different material than the body of thestructure element. According to various embodiments, a structure elementmay have the shape of a fin, wherein, according to some embodiments, thefin may include silicon and the surface layer of the fin may include anelectrically insulating material (e.g. an oxide, e.g. a nitride, e.g.silicon oxide, e.g. silicon nitride, e.g. silicon oxynitride, and thelike) or the surface layer may include a layer stack of more than oneelectrically insulating layers (e.g. an oxide-nitride-oxide layer stackincluding silicon oxide and silicon nitride). According to variousembodiments, at least one structure element of the plurality ofstructure elements (e.g. all structure elements of the plurality ofstructure elements) may be formed by patterning a silicon wafergenerating a silicon structure, wherein the electrically insulatingsurface layer may be formed by high temperature oxidation of the siliconstructure. According to various embodiments, forming the plurality ofstructure elements may include at least one layering process (e.g.depositing at least one layer using LPCVD or atomic layer deposition).

As shown in FIG. 6A, according to various embodiments, an electricallyinsulating layer 602 may form the surface layer of a plurality ofstructure elements, e.g. forming the surface of the structure elementsin analogy to FIG. 5A. FIG. 6A illustrates a cross section of aplurality of structure elements 402 a-402 e (e.g. a plurality of fins)including an insulating surface layer 602 according to variousembodiments (five structure elements 402 a, 402 b, 402 c, 402 d, and 402e are shown as an example, however the number of structure elements maybe smaller than five or larger than five, and may be any number greaterthan one in general), wherein at least two adjacent structure elements(e.g. at least two adjacent fins) may have a first distance between eachother (e.g. first distance 403 between the two adjacent structureelements 402 a and 402 b and between the two adjacent structure elements402 d and 402 a in the embodiment shown) and at least two adjacentstructure elements (e.g. at least two adjacent fins) may have a distancebetween each other (e.g. distance 405 between the two adjacent structureelements 402 b and 402 c and between the two adjacent structure elements402 c and 402 e in the embodiment shown), which is larger than the firstdistance (e.g. first distance 403). According to various embodiments,subsequently 230, 240, and 250 of method 200 may be carried out, asalready described above, which may result in a structure 601 as shown inFIG. 6B in analogy to FIGS. 4A and 4B and FIGS. 5A and 5B and thecorresponding description.

According to various embodiments, an insulating surface layer (or aninsulating surface layer stack) of the structure elements (e.g. surfacelayer 502 or surface layer 602) may have a thickness in the range ofabout 1 nm to about 100 nm, e.g. about 2 nm to about 80 nm, e.g. about 5nm to about 40 nm, e.g. in the range of about 5 nm.

According to various embodiments, the structure 501 and the structure601 shown in FIGS. 5B and 6B may illustrate cross sections of a FinFETarrangement respectively (cf. FIG. 9).

According to various embodiments, a plurality of structure elements mayinclude a silicon fin surrounded by a gate oxide (e.g. insulating layer502 or insulating layer 602), wherein the first electrically conductivelayer (e.g. the remaining portions 308 a, 308 b, and 308 c of firstlayer 308 covering the sidewalls 306 a, 306 b of the structure elements302 a-302 e as shown in FIG. 3G) may form the control gate of a FinFET.According to various embodiments, the height of the control gate (e.g.the height 316 of the remaining material of the first layer 308 at thesidewalls 306 a, 306 b of the structure elements 302 a-302 e shown inFIG. 3H, or the height 416 of the remaining material of the first layer408 at the sidewalls 406 a, 406 b of the structure elements 402 a-402 eshown in FIG. 4B) may be the same for all gates at the sidewalls of theplurality of structure elements, independently from the distance betweentwo adjacent structure elements. According to various embodiments, theelectrical properties of the FinFETs which may be at least partiallyformed using method 100 or method 200, as described herein, may be thesame for all FinFETs of the plurality of FinFETs, independently from thedistance between two adjacent fins (e.g. due to that all FinFETs mayhave the same gate height). According to various embodiments, the firstlayer (e.g. first layer 308 or first layer 408) may be partially removedto expose the sidewalls of the plurality of fins partially, whereinremoving a portion of the first layer in regions between the adjacentfins may be carried out using an etch process, as for example reactiveion etching or plasma etching. According to various embodiments, sincethe open areas of the first layer at the sidewalls of the structureelements may be, due to applying method 100 or method 200 as describedherein, independent from the distance between the adjacent structureelements, an etch process, as for example reactive ion etching or plasmaetching, may be used without or with reduced effects of the loadingmechanisms typically occurring during the plasma etching or reactive ionetching.

According to various embodiments, more than one additional layer may beformed over the first layer, in 230 (or in 130 as well), wherein theplurality of additional layers may cover the exposed surface of thefirst layer. According to various embodiments, forming more than oneadditional layer may include forming a second layer over the firstlayer, and subsequently forming a third layer over the second layer,wherein at least one of the second layer and the third layer may fill aremaining space between the at least two adjacent structure elements.

As shown in FIG. 7A, a first remaining space, e.g. remaining space 410 abetween structure elements 402 a and 402 b, as shown in FIG. 4A, may befilled by a second layer 712, covering the first layer 408, wherein thesecond remaining space, e.g. remaining space 410 b between structureelements 402 b and 402 c, as shown in FIG. 4A, may be not filledcompletely by the second layer 712, according to various embodiments.Further, after forming the second layer 712, a remaining space which maybe not filled completely by second layer 712 (e.g. remaining space 710as shown in FIG. 7A) may be filled by a third layer 714 covering thesecond layer 712. According to various embodiments, the first layer 408may be formed to have a small thickness (e.g. a thickness in the rangefrom about 10 nm to about 100 nm, e.g. a thickness in the range fromabout 20 nm to about 50 nm) e.g. by using a conformal depositionprocess. According to various embodiments, the second layer 712 may beformed to have a larger thickness, (e.g. a thickness in the range from100 nm to 1 μm, e.g. in the range from about 40 nm to about 200 nm, e.g.from about 80 nm to about 160 nm, e.g. a layer thickness of about 100 nmaccording to one embodiment (or larger than 100 nm, according to anotherembodiment), e.g. by using a CVD process (as described above). Accordingto various embodiments, the second layer may 712 be grown by thermaloxidation of the first layer 408, e.g. by forming a high temperatureoxide, e.g. by forming a high-temperature silicon oxide if the firstlayer 408 includes silicon (e.g. polycrystalline silicon). According tovarious embodiments, the second layer 712 and the third layer 714 mayinclude an electrically insulating material. According to variousembodiments, the second layer 712 and the third layer 714 may include anoxide layer, e.g. a silicon oxide layer, or a nitride layer, e.g.silicon nitride layer.

According to various embodiments, the material or materials forming theadditional layer (e.g. additional layer 312, e.g. additional layer 412),or the plurality of additional layers, e.g. the second layer (e.g.second layer 712) and the third layer (e.g. third layer 714), may beselected from a group of suitable materials in such a way, that thefirst layer (e.g. first layer 308 or 408) may be selectively etched in150 and 250, wherein the first layer may be partially removed exposingthe sidewalls of at least two adjacent structure elements partially. Forexample, according to various embodiments, the first layer may includesilicon, and the at least one additional layer may include siliconoxide. According to various embodiments, the surface layer of theplurality of structure elements (e.g. surface layer 502, e.g. surfacelayer 602), or the plurality of structure elements (e.g. structureelements 302 a, 302 b, and 302 c, e.g. structure elements 402 a, 402 b,and 402 c) may include silicon oxide, such that the first layer (e.g.first layer 308 or 408) may be etched selectively with respect to thestructure elements and the at least one additional layer (e.g.additional layer 312, e.g. additional layer 412, e.g. second layer 712and third layer 714).

According to various embodiments, the selective etch process of thefirst layer 408, as described referring to FIG. 7A, may result instructure 701 as shown in FIG. 7B, in analogy to the processes referringto method 100 and method 200 described before.

According to various embodiments, since an opening, e.g. a hole, arecess or a trench, may also be commonly referred to as a structureelement (e.g. an array of holes may generate a complex structure ofremaining material between two adjacent holes respectively), it has tobe noted, that in the description referring to method 100 and method200, an opening, e.g. a hole, a recess or a trench, itself may not beregarded as a structure element, but that at least one opening, e.g. atleast one hole, at least one recess or at least one trench, may generateat least one structure element, wherein the at least one structureelement may be formed by remaining material between adjacent openings,e.g. adjacent holes, adjacent recesses or adjacent trenches. In thiscase, a distance between two adjacent structure elements may be definedby a lateral extension of an opening (e.g. hole, recess, or trench), anda width of a generated structure element may be defined by a distancebetween respective sidewalls of adjacent openings (e.g. holes, recesses,or trenches). According to various embodiments, forming a plurality ofstructure elements at least one of over and in a carrier, as included in110 shown in FIG. 1, may include generating at least one structureelement by forming an opening (e.g. at least one of a hole, trench, andrecess).

According to various embodiments, a plurality of structure elementsformed at least one of over and in a carrier, as described referring tomethod 100 and method 200, may include forming a plurality of holes, asshown exemplarily in FIG. 8. According to various embodiments, FIG. 8shows a top view 801 and a cross section 802 of a carrier 302 includinga plurality of holes 804 a, 804 b (two holes 804 a and 804 b are shownas an example, however the number of holes may be greater than two, andmay be any integer number greater than or equal to two in general) (e.g.at a first processing stage, as for example after 110 or 210 in methods100 and 200, respectively, has been carried out), wherein at least onehole (e.g. hole 804 a) may have a first diameter 803, and at least onehole (e.g. hole 804 b) may have a diameter 805 being larger than thefirst diameter 803.

As shown in FIG. 8, according to various embodiments, the distancebetween two adjacent structure elements, as described above referring tomethod 100 and method 200, may be in this case defined by the lateralextension of the hole (e.g. the diameter of the respective hole as shownin FIG. 8), and the width of a generated structure element (e.g.generated structure element 807) may be defined by a distance, e.g.smallest distance, (e.g. distance 807 a) between respective sidewalls oftwo adjacent holes (e.g. by the distance 807 a between the sidewall 806a of the first hole 804 a and the sidewall 806 b of the second hole 804b). According to various embodiments, forming a plurality of structureelements at least one of over and in a carrier, as included in method100 shown in FIG. 1 and method 200 shown in FIG. 2, may includegenerating at least one structure element by forming at least one hole.

As can be seen by the example shown in FIG. 8, method 100 and method 200may also be applied on a carrier 302 including a plurality of holes,wherein at least one hole 804 a may have a first diameter 803 and atleast one hole 804 b may have a diameter 805 which is larger than thefirst diameter (e.g. referring to method 200), or wherein at least onehole 804 a may have a first diameter 803 and at least one hole 804 b mayhave a diameter 805 which is larger than two times the first diameter803 (e.g. referring to method 100). In analogy, the height of theremaining material of a first layer at the sidewalls (e.g. sidewalls 806a and 806 b as shown in FIG. 8) of the plurality of holes may have thesame height for all holes independently from the respective diameter ofthe hole (e.g. diameter 803 and 805), if the method 100 or method 200 iscarried out as described above. Referring to this, according to variousembodiments, loading effects (e.g. aspect ratio dependent etching)during the formation of a structure partially covering the respectivesidewalls of a plurality of holes (e.g. the partially removed firstlayer) may be reduced or may be avoided by using method 100 or method200, as described above.

According to various embodiments, the diameter of a hole (e.g. 804 a or804 b) may be in the range from about 5 nm to about 200 nm, e.g. about20 nm to about 150 nm, e.g. about 60 nm to about 120 nm, or may be about90 nm according to one embodiment (or larger than 200 nm, according toanother embodiment).

According to various embodiments, a plurality of structure elementsformed at least one of over and in a carrier, as described referring tomethod 100 and method 200, may include forming a plurality of recesses(or trenches), as shown exemplarily in FIG. 9. According to variousembodiments, FIG. 9 shows a top view 901 and a cross sectional view 902of a carrier 302 (e.g. at a first processing stage, as for example after110 or 210 have been carried out) including a plurality of recesses (ortrenches), as for example recess 904 a and recess 904 b, wherein atleast one recess (e.g. recess 904 a) may have a first extension 903, andat least one recess (e.g. recess 904 b) may have an extension 905 beinglarger than the first extension 903. According to various embodiments,the first extension 903 of the recess 904 a may define a first distancebetween two adjacent structure elements (e.g. the first distance 903between structure element 302 a and structure element 302 b) and theextension 905 of recess 904 b (being larger than the first extension903) may define a distance between two adjacent structure elements (e.g.distance 905 between structure element 302 b and structure element 302c) which is larger than the first distance (e.g. the first distance 903between structure element 302 a and structure element 302 b).

As shown in FIG. 9, according to various embodiments, the distancebetween two adjacent structure elements, as described above referring tomethod 100 and method 200, may be in this case defined by the lateralextension of the recess, and the width of the corresponding structureelement (e.g. generated structure element 302 b) may be defined by adistance (e.g. distance 907 a) between respective sidewalls of twoadjacent recesses (e.g. by the distance 907 a between the sidewall 906 aof the recess 904 b and the sidewall 906 b of the recess 904 c).According to various embodiments, forming a plurality of structureelements at least one of over and in a carrier, as included in method100 shown in FIG. 1 and method 200 shown in FIG. 2, may includegenerating at least one structure element by forming at least one recess(or trench).

As can be seen by the example shown in FIG. 9, method 100 and method 200may also be applied to a carrier 302 including a plurality of recesses(or trenches), wherein at least one recess (or trench) may have a firstextension and at least one recess (or trench) may have an extensionwhich is larger than the first extension (e.g. referring to method 200),or wherein at least one recess (or trench) may have a first extensionand at least one recess (or trench) may have an extension which islarger than two times the first extension (e.g. referring to method100). In analogy, the height of the remaining material of a first layerat the sidewalls (e.g. at the sidewalls 906 a and 906 b) of theplurality of recesses (or trenches) may have the same height for allrecesses (or trenches) independently from the respective extension ofthe recess (or trench) (e.g. extension 903 and 905), if the method 100or method 200 is carried out as described above. Referring to this,according to various embodiments, loading effects (e.g. aspect ratiodependent etching) during the formation of a structure partiallycovering the respective sidewall of a plurality of recesses (ortrenches) (e.g. the partially removed first layer 308 or 408 after 150or 250 in method 100 or 200, respectively) may be reduced or may beavoided by using method 100 or method 200, as described above.

Further, according to various embodiments, the first distance (e.g.distance 303, 403, 803, 903) may be in the range from about 10 nm toabout 300 nm, e.g. about 20 nm to about 200 nm, e.g. about 70 nm toabout 110 nm, e.g. about 80 nm to about 100 nm, e.g. about 90 nm, ore.g. smaller than 90 nm or e.g. larger than 90 nm. According to variousembodiments, at least two adjacent structure elements may have adistance between each other (e.g. distance 305, 405, 805, 905) beinglarger than the corresponding first distance (e.g. distance 303, 403,803, 903), e.g. distance 305, 405, 805, 905 may be in the range fromabout 10 nm to about 600 nm, e.g. about 50 nm to about 500 nm, e.g.about 90 nm to about 300 nm, e.g. about 170 nm to about 300 nm, e.g.smaller than 180 nm, or e.g. larger than 180 nm.

According to various embodiments, at least two adjacent structureelements may have a distance between each other which is a multiplicityof the first distance between two adjacent structure elements (e.g.three times, five times, or seven times the first distance according tosome embodiments, or another multiple of the first distance according toother embodiments). According to various embodiments, at least twoadjacent structure elements may have a distance between each other whichis three times the first distance between two adjacent structureelements (e.g. the first distance may be about 90 nm and two adjacentstructure elements may have a distance of about 270 nm between eachother).

According to various embodiments, the width (or the lateral extension)of a structure element may be in the range from about 10 nm to 200 nm,e.g. about 20 nm to about 170 nm, e.g. about 70 nm to about 110 nm, e.g.about 80 nm to about 100 nm, e.g. about 90 nm.

According to various embodiments, at least one structure element of theplurality of structure elements may have a different height than theother structure elements. Further, according to various embodiments, atleast one opening, e.g. at least one recess, at least one trench or atleast one hole (as shown in FIGS. 8 and 9), may have a different depththan the other openings, e.g. recesses, trenches or holes. As a result,according to various embodiments, the sidewalls of the structureelements may not have necessarily the same size (or the same area).

According to various embodiments, at least one structure element of theplurality of structure elements may be a dummy structure element, whichmay have no electrical functionality in an integrated circuit. Accordingto various embodiments, at least one structure element of the pluralityof structure elements may be differently designed with respect to theother structure elements.

According to another embodiment, the first layer (e.g. first layer 308or first layer 408) may not cover the bottom surfaces of regions betweenat least one pair of adjacent structure elements (e.g. the bottomsurface of region 311 between the structure elements 302 c and 302 e, asshown in FIG. 3C, or bottom surface of region 411 between the structureelements 402 c and 402 e, as shown in FIG. 4A). According to anotherembodiment, the first layer (e.g. first layer 308 or first layer 408)may be partially removed from the bottom surfaces regions between thestructure elements (e.g. from the bottom surface of region 311 betweenthe structure elements 302 c and 302 e, as shown in FIG. 3C, or from thebottom surface of region 411 between the structure elements 402 c and402 e, as shown in FIG. 4A), after the first layer (e.g. first layer 308or first layer 408) is deposited over the structure elements (e.g. byusing a patterning process). According to another embodiment, the firstlayer (e.g. first layer 308 or first layer 408) may cover at leastpartially the sidewalls of the structure elements (e.g. the sidewalls306 a, 306 b of structure elements 302 a-302 e or the sidewalls 406 a,406 b of structure elements 402 a-402 e), wherein the regions (or atleast two regions) formed by the material of the first layer 308 at thesidewalls of the respective structure elements are not electricallyconnected with each other via material of the first layer 308.

According to various embodiments, the term “surface layer” as usedherein above with regards to a “surface layer or a surface layer stack”of a structure element, or a “surface layer” of a plurality of structureelements may refer to at least the upper surface and the sidewalls ofeach structure element of the plurality of structure elements.

According to various embodiments, two control gates provided by theelectrically conductive first layer at the adjacent sidewalls of twoadjacent structure elements (e.g. two adjacent control gates of twoadjacent FinFETS) may be electrically connected with each other due tothe remaining material of the first layer between the two adjacentstructure elements (e.g. the bottom region 506 b between the structureelements 302 b and 302 c, as for example shown in FIGS. 5A and 5B, mayelectrically connect the respective control gates provided by the firstlayer 308).

According to another embodiment (not shown in figures), the controlgates provided by the electrically conductive first layer at therespective sidewalls of the structure elements (e.g. of the FinFETS) maynot be electrically connected with each other by a remaining material ofthe first layer between two adjacent structure elements (e.g. by theremaining material in the bottom region 506 b between the structureelements 302 b and 302 c, as for example shown in FIGS. 5A and 5B).Therefore, according to various embodiments, remaining material in thebottom region between two adjacent structure elements, whichelectrically connects two adjacent control gates at the respectivesidewalls of two adjacent structure elements (e.g. remaining material ofthe first layer 308 in the bottom region 506 b between the structureelements 302 b and 302 c, as for example shown in FIGS. 5A and 5B), maybe removed, e.g. before the at least one additional layer may be formedover the first layer (e.g. layer 312 formed over layer 308).

According to various embodiments, a part of the first layer may beremoved before the at least one additional layer may be formed over thefirst layer, such that the gates of the FinFETS may be separated fromeach other.

According to various embodiments, a method for processing a carrier mayinclude: forming a plurality of structure elements at least one of overand in a carrier, wherein at least two adjacent structure elements ofthe plurality of structure elements may have a first distance betweeneach other; depositing a first layer over the plurality of structureelements, the first layer having a thickness which equals the firstdistance between the at least two adjacent structure elements; formingat least one additional layer over the first layer, wherein the at leastone additional layer may cover an exposed surface of the first layer;removing a portion of the at least one additional layer to expose thefirst layer partially; partially removing the first layer, wherein atleast one sidewall of the at least two adjacent structure elements maybe partially exposed.

According to various embodiments, a method for processing a carrier mayinclude: forming a plurality of structure elements at least one of overand in a carrier, wherein at least two adjacent structure elements ofthe plurality of structure elements may have a first distance betweeneach other; depositing a first layer over the plurality of structureelements, the first layer having a thickness which is smaller than halfof the first distance between the at least two adjacent structureelements; forming at least one additional layer over the first layer,wherein the at least one additional layer may cover an exposed surfaceof the first layer; removing a portion of the at least one additionallayer to expose the first layer partially; and partially removing thefirst layer, wherein at least one sidewall of the at least two adjacentstructure elements is partially exposed.

According to various embodiments, the plurality of structure elementsmay be formed over a main processing surface of the carrier.

According to various embodiments, the plurality of structure elementsmay include at least one electrically insulating layer at a surface ofat least one structure element of the plurality of structure elements.

According to various embodiments, the at least one electricallyinsulating layer may include an oxide layer.

According to various embodiments, at least one structure element of theplurality of structure elements may have the shape of a fin.

According to various embodiments, at least one structure element of theplurality of structure elements may be part of a FinFET.

According to various embodiments, depositing the first layer over theplurality of structure elements may include conformally depositing thefirst layer over the plurality of structure elements.

According to various embodiments, the first layer may include at leastone electrically conductive material.

According to various embodiments, the first layer may includeelectrically conductive polycrystalline silicon.

According to various embodiments, forming the at least one additionallayer over the first layer may include depositing at least one layerusing a conformal deposition process.

According to various embodiments, forming the at least one additionallayer over the first layer may include growing at least one layer usingthermal oxidation.

According to various embodiments, the at least one additional layer mayinclude a material that is different from a material of the first layer.

According to various embodiments, forming the at least one additionallayer over the first layer may include: forming at least a second layerover the first layer, wherein the second layer may fill a remainingspace between adjacent structure elements of the plurality of structureelements.

According to various embodiments, at least two adjacent structureelements of the plurality of structure elements may have a distancebetween each other which is larger than two times the first distance.

According to various embodiments, at least two adjacent structureelements of the plurality of structure elements may have a distancebetween each other which is larger than two times the first distance,wherein the first layer may have a thickness which equals the firstdistance.

According to various embodiments, at least two adjacent structureelements (e.g. at least one pair of adjacent structure elements) of theplurality of structure elements may have a first distance between eachother and at least two adjacent structure elements (e.g. at least oneother pair of adjacent structure elements) of the plurality of structureelements may have a distance between each other which is larger than twotimes the first distance, wherein the first layer may be formed over theplurality of structure elements, the first layer having a thicknesswhich equals the first distance.

According to various embodiments, forming the at least one additionallayer may include: forming a second layer over the first layer andforming a third layer over the second layer, wherein at least one of thesecond layer and the third layer may fill a remaining space between atleast two adjacent structure elements of the plurality of structureelements.

According to various embodiments, at least two adjacent structureelements of the plurality of structure elements may have a firstdistance between each other and at least two adjacent structure elementsof the plurality of structure elements may have a distance between eachother which is larger than the first distance.

According to various embodiments, at least two adjacent structureelements of the plurality of structure elements may have a distancebetween each other which is larger than the first distance.

According to various embodiments, at least two adjacent structureelements of the plurality of structure elements may have a distancebetween each other which is larger than the first distance, wherein thefirst layer may be formed over the plurality of structure elements, thefirst layer having a thickness which is smaller than half of the firstdistance.

According to various embodiments, at least two adjacent structureelements (e.g. at least one pair of adjacent structure elements) of theplurality of structure elements may have the first distance between eachother and at least two adjacent structure elements (e.g. at least oneother pair of adjacent structure elements) of the plurality of structureelements may have a distance between each other which is larger than thefirst distance, wherein the first layer may be formed over the pluralityof structure elements, the first layer having a thickness which issmaller than half of the first distance.

According to various embodiments, removing the portion of the at leastone additional layer to expose the first layer partially may includepartially removing the at least one additional layer and removing aportion of the first layer, such that a common surface is exposed,wherein the common surface may be formed at least by the upper surfacesof the plurality of structure elements (e.g. additionally by the surfaceof the carrier as well, as described referring to FIG. 3B). According tovarious embodiments, exposing the common surface by partially removingthe at least one additional layer and removing the portion of the firstlayer may include a CMP process, which may be selective or non-selectiveto the specific material of the first layer and the at least oneadditional layer.

According to various embodiments, a method for processing a carrier mayinclude: forming a plurality of structure elements at least one of overand in a carrier, wherein at least two adjacent structure elements mayhave a first distance between each other and at least two adjacentstructure elements may have a distance between each other being largerthan the first distance, depositing a first layer over the carrier, thefirst layer having a thickness smaller than half of the first distance,filling a remaining space between the adjacent structure elements with afill material after depositing the first layer; and partially removingthe first layer, wherein at least one sidewall of at least one structureelement of the plurality of structure elements may be partially exposed.

According to various embodiments, a method for processing a carrier mayinclude: forming a plurality of structure elements at least one of overand in a carrier, wherein at least two adjacent structure elements mayhave a first distance between each other and at least two adjacentstructure elements may have a distance between each other being largerthan two times the first distance; depositing a first layer over thecarrier, the first layer having a thickness which equals the firstdistance, filling a remaining space between the adjacent structureelements with fill material after depositing the first layer; andpartially removing the first layer, wherein at least one sidewall of atleast one structure element of the plurality of structure elements maybe partially exposed.

According to various embodiments, the plurality of structure elementsmay include at least one electrically insulating layer at the surface ofat least one structure element of the plurality of structure elements.

According to various embodiments, filling the remaining space betweenthe adjacent structure elements may include: forming a second layer overthe first layer, depositing a third layer over the second layer, whereinat least one of the second layer and the third layer may fill theremaining space between the adjacent structure elements; and partiallyremoving material of at least the second layer and the third layer topartially expose the first layer.

According to various embodiments, forming the second layer over thefirst layer may include forming the second layer over the first layerusing a conformal deposition process.

According to various embodiments, forming the third layer over thesecond layer may include forming the third layer over the second layerusing a conformal deposition process.

According to various embodiments, at least one of the second layer andthe third layer may include a material that is different from a materialof the first layer.

According to various embodiments, forming the second layer over thefirst layer may include forming the second layer using high temperatureoxidation.

According to various embodiments, filling the remaining space betweenadjacent structure elements may include: forming a second layer over thefirst layer which may fill the remaining space between adjacentstructure elements; and partially removing material of at least thesecond layer to at least partially expose the first layer.

According to various embodiments, depositing the first layer over thecarrier may include conformally depositing the first layer.

According to various embodiments, the first layer may includeelectrically conductive material.

According to various embodiments, the first layer may includepolycrystalline silicon.

According to various embodiments, at least one structure element of theplurality of structure elements may be at least a part of a FinFET.

According to various embodiments, the at least one additional layer mayserve as an etch mask for partially removing the first layer, wherein atleast one sidewall of the plurality of structure elements is partiallyexposed. According to various embodiments, the insulating surface layer(which may be a part of at least one structure element of the pluralityof structure elements) may serve as an etch mask for partially removingthe first layer, wherein at least one sidewall of the plurality ofstructure elements is partially exposed.

While the invention has been particularly shown and described withreference to specific embodiments, it should be understood by thoseskilled in the art that various changes in form and detail may be madetherein without departing from the spirit and scope of the invention asdefined by the appended claims. The scope of the invention is thusindicated by the appended claims and all changes which come within themeaning and range of equivalency of the claims are therefore intended tobe embraced.

What is claimed is:
 1. A method for processing a carrier, the methodcomprising: forming a plurality of structure elements at least one ofover and in a carrier, wherein at least two adjacent structure elementsof the plurality of structure elements have a first distance betweeneach other; depositing a first layer over the plurality of structureelements, the first layer having a thickness which is less than half ofthe first distance between the at least two adjacent structure elements;forming at least one additional layer over the first layer, wherein theat least one additional layer covers an exposed surface of the firstlayer; removing a portion of the at least one additional layer to exposethe first layer partially; partially removing the first layer, whereinat least one sidewall of the at least two adjacent structure elements ispartially exposed.
 2. The method of claim 1, wherein at least twoadjacent structure elements of the plurality of structure elements havea distance between each other which is larger than the first distance.3. The method of claim 1, the plurality of structure elements comprisingat least one electrically insulating layer at a surface of at least onestructure element of the plurality of structure elements.
 4. The methodof claim 2, wherein the at least one electrically insulating layercomprises an oxide layer.
 5. The method of claim 1, wherein at least onestructure element of the plurality of structure elements has the shapeof a fin.
 6. The method of claim 1, wherein at least one structureelement of the plurality of structure elements is part of a FinFET. 7.The method of claim 1, wherein depositing the first layer over theplurality of structure elements comprises conformally depositing thefirst layer over the plurality of structure elements.
 8. The method ofclaim 1, wherein the first layer comprises electrically conductivematerial.
 9. The method of claim 1, wherein forming the at least oneadditional layer comprises depositing at least one layer using aconformal deposition process.
 10. The method of claim 1, wherein formingthe at least one additional layer comprises growing at least one layerusing high temperature oxidation.
 11. The method of claim 1, wherein theat least one additional layer comprises a material that is differentfrom a material of the first layer.
 12. The method of claim 1, whereinforming the at least one additional layer comprises: forming a secondlayer over the first layer, forming a third layer over the second layer,wherein at least one of the second layer and the third layer fills aremaining space between adjacent structure elements of the plurality ofstructure elements.
 13. The method of claim 1, wherein, after removingthe portion of the at least one additional layer, a part of the at leastone additional layer remains between the at least two adjacent structureelements of the plurality of structure elements having the firstdistance between each other.
 14. The method of claim 2, wherein, afterremoving the portion of the at least one additional layer, a part of theat least one additional layer remains between the at least two adjacentstructure elements of the plurality of structure elements having thedistance between each other which is larger than the first distance. 15.The method of claim 1, wherein a remaining part of the at least oneadditional layer, which is disposed between the at least two adjacentstructure elements of the plurality of structure elements having thefirst distance between each other, is spaced apart from these at leasttwo adjacent structure elements with a distance that substantiallyequals the thickness of the first layer.
 16. The method of claim 2,wherein a remaining part of the at least one additional layer, which isdisposed between the at least two adjacent structure elements of theplurality of structure elements having the distance between each otherwhich is larger than the first distance, is spaced apart from these atleast two adjacent structure elements with a distance that substantiallyequals the thickness of the first layer.
 17. The method of claim 2,wherein a remaining part of the at least one additional layer, which isdisposed between the at least two adjacent structure elements of theplurality of structure elements having the first distance between eachother, is spaced apart from these at least two adjacent structureelements with a distance that substantially equals the thickness of thefirst layer; and wherein a remaining part of the at least one additionallayer, which is disposed between the at least two adjacent structureelements of the plurality of structure elements having the distancebetween each other which is larger than the first distance, is spacedapart from these at least two adjacent structure elements with adistance that substantially equals the thickness of the first layer. 18.The method of claim 1, wherein partially removing the first layercomprises reducing a height of the first layer thereby exposing the atleast one sidewall of the at least two adjacent structure elementspartially.